suncitygroup太阳集团-Welcome

With the vigorous development of the global semiconductor industry, what value does advanced packaging highlight? What role does characteristic technology play? In the context of tight global semiconductor supply, how should the industry overcome the problem of lack of "core"? On semicon china2021, we seem to smell two important trends in the development of semiconductor technology in the future.

Packaging is becoming more and more important

At present, the chip manufacturing process has reached the 5nm node, gradually approaching the physical limit. Wu Hanming, academician of the Chinese Academy of engineering and Dean of the school of micro nano electronics of Zhejiang University, said in his semicon china2021 speech that in the era of post Moore's law, the industry no longer simply "discusses heroes" in terms of line width, line distance and integration, but more considers how to improve the performance of the system and how to improve the integration on the whole micro system. Based on this, the value and importance of packaging in the semiconductor industry chain are becoming more and more prominent.

Smart phones, automotive electronics, 5g, AI and other emerging markets put forward higher requirements for packaging, which makes the packaging technology develop towards system integration, three-dimensional, ultra detail interconnection and so on. Therefore, advanced packaging has become an important development trend in the packaging field. Among them, SIP system level packaging is the most advanced mainstream packaging technology. It is reported that this technology can integrate multiple chips with different functions into one module to realize that one chip has multiple functions. SIP system level packaging can not only overcome the problems of process compatibility, signal mixing, noise interference and electromagnetic interference in the process of chip system integration, but also reduce the cost of chip system integration. It is one of the most important technical trends in the field of advanced packaging in the future.

Another development path of advanced packaging is wafer level packaging. Zheng Li, CEO of Changdian technology, said in an interview with reporters that if wafer level packaging is to continue to develop in multi-dimensional directions, such as 2D, 2.5D and 3D, it is bound to cooperate with wafer factories. Zheng Li said that this is because the wafer factory has the ability to manufacture TSV (silicon via) process on the wafer. In the case of silicon adapter board, the wafer factory can also make silicon interposer, that is, wafers with high-density wiring. The packaging and testing factory needs to carry out the process of RDL (wafer redistribution), and then re integrate the wiring at the level of packaging and testing.

Zheng Li pointed out to reporters that the process of the wafer factory on the wafer is more advanced, which is very helpful for the development of the packaging and testing field to the wafer level packaging, because the wafer factory has this equipment and is also good at this process“ The cooperation between wafer factories and packaging factories will accelerate the development of wafer level packaging to more extensive applications and deeper technological innovation. We are very willing to see such interaction between the two sides. " Zheng Li said.

Miniaturization and integration are also two major trends in the development of advanced packaging. Liu Yang, head of Baiwei storage intelligent terminal storage chip division, believes that in the field of memory packaging, ultra-thin die (grain) and heterogeneous integration process are the main driving force of industrial development. At present, advanced packaging is enabling the interconnection of all things, which is expected to shine in many fields such as RF chips, artificial intelligence, Internet of things, mobile intelligent terminals and so on.

Take on the great responsibility of characteristic technology

In the post Moore's law era, the research and development of advanced processes has fallen into a bottleneck. Relatively speaking, characteristic processes (such as MEMS, RF, high voltage and power management) do not fully pursue the reduction of device size, and have the advantages of non size dependence and relatively mature process. It is a "sharp weapon" to improve chip performance in the era of post Moore's law. Luo Zhenqiu, general manager of TSMC (Nanjing) Co., Ltd., once explained the relationship between the characteristic process and chip performance: "if the function of the chip is compared to the signal intended to be transmitted, the characteristic process is the WiFi that transmits the signal. Therefore, only by continuously promoting the special process can we give better play to the performance of the chip."

In recent years, the demand for characteristic processes in emerging markets driven by emerging technologies has continued to soar. With the development of semiconductor industry and the increasing diversification of terminal applications, the market demand for differentiated processes is also rising. Especially for smart cards, power management chips and discrete devices, which account for the absolute majority of semiconductor chips, the characteristic process is a better choice in terms of manufacturing cost, production stability and delivery reliability.

As Wu Hanming said at the meeting, characteristic technology has great potential in the post Moore law era. Industrial securities data show that 83% of the market is above 10nm, and there is huge innovation space at nodes. At this stage, although domestic enterprises do not have an advantage in the R & D of advanced processes, the broad market faced by characteristic processes has also built a stage for domestic enterprises to show their strength. At present, SMIC has vigorously expanded its 8-inch production capacity in Tianjin, Shenzhen, Ningbo, Shaoxing and other places, and actively engaged in the research and development of characteristic processes. In addition, Huahong Hongli, which focuses on wafer foundry of differentiated technology, has also established a number of differentiated process platforms, including embedded nonvolatile memory (envm), power discrete device (discrete), analog and power management IC, radio frequency (RF), etc.

It is worth mentioning that silicon carbide (SIC) high-power devices are an important breakthrough point in the characteristic process market. The relevant technologies are basically mature, and the market is at the critical point of rapid start-up. As the largest downstream market of power semiconductors, new energy vehicles will provide strong and sustainable development power for power semiconductors represented by silicon carbide. Wu Youwen, vice president of Wentai technology, said that in recent years, under the general trend of automotive electronization, the automotive power semiconductor market has gradually become one of the fastest-growing application markets. The electronization of power system, in vehicle network and ADAS system have become the core factors to promote the vigorous development of the market.

With the increasing importance of power devices, the new design and technology of power module has become very critical. However, as Li Chuanying, CEO of Hanxin technology, said, the manufacturing process of VMOS (V-slot MOS FET) devices is more difficult than umos (U-type metal oxide semiconductor) devices. It is difficult for non IDM manufacturers to meet the requirements of secondary epitaxial growth, resulting in that no manufacturer can realize the mass production of this product at present.